1/4 rev. s t r u c t u r e : silicon monolithic integrated circuit product : sound processor for car audio t y p e : BD37511FS p a c k a g e : s s o p - a 2 0 feature 1. reduce switching noise of mute, main volume, fader volume, bass, and treble by using advanced switch circuit [possible to control all steps] 2. decrease the number of external compon ents by built-in 2-band equalizer filter. and, possible to control gv of 2-band equalizer by i 2 c bus control. 3. it is possible for the bass, treble to the gain adjustme nt quantity of 20db and 1 db step gain adjustment. 4. bi-cmos process is suitable for the design of low curre nt and low energy. and it provides more quality for small scale regulator and heat in a set. 5. package is ssop-a20. putting input-terminals togethe r and output-terminals together can make pcb layout easier and can makes area of pcb smaller.) 6. it is possible to control by 3.3v / 5v for i 2 c bus. absolute maximum ratings (ta=25 ) paramete r symbol limits unit power supply voltage vcc 10.0 v input voltage vin vcc+0.3 gnd-0.3 v power dissipation pd 940 1m w storage temperature tastg -55 +150 1 at ta 25c or higher, this value is decreaced to 7.5mw/c when rohm standard board is mounted. rohm standard board: size 70 70 1.6(mm 3 ) material fr4 glass-epoxy substrate (copper foil area: not more than 3%). operating range parameter symbol min. typ. max. unit power supply voltage vcc 7.0 9.5 v temperature topr -40 +85 design against radiation-proof isn?t made.
2/4 rev. function function specifications input selector stereo 3 single-end input input gain 0 20db (1db step) mute possible to use ?advanced switch? for prevention of switching noise. volume 0db - 40db (1db step) possible to use ?advanced switch? for prevention of switching noise. bass -20 +20db (1db step), q=1, fo=100hz possible to use advanced switch at changing gain treble -20 +20db (1db step), q=1, fo=10kz possible to use advanced switch at changing gain fader 0db - 62db (1db step), -db possible to use ?advanced switch? for prevention of switching noise. electrical characteristic (unless specified particularly, ta=25 , vcc=8.5v, f=1khz, vin=1vrms, rg=600 , r l =10k , a input, input gain 0db, mute off, volume 0db, tone control 0db, fader 0db) item symbol limit unit condition min. typ. max. current upon no signal i q 15 30 ma no signal voltage gain g v -1.5 0 1.5 db gv=20log(vout/vin) channel balance cb -1.5 0 1.5 db cb = gv1-gv2 total harmonic distortion thd+n 0.005 0.05 vout=1vrms bw=400-30khz output noise voltage v no 6 25 vrms rg = 0 bw = ihf-a residual output noise voltage v nor 2 10 vrms fader= - db rg=0 bw=ihf-a cross-talk between channels ctc -100 -90 db rg=0 ctc=20log(vout/vin) bw=ihf-a ripple rejection rr -70 -40 db f=100hz vrr=100mvrms rr=20log(vout/vccin) maximum input voltage v im 2.1 2.3 vrms vim at thd+n(vout)=1% bw=400-30khz maximum attenuation g v min -100 -85 db fade r =-db gf=20log(vout/vin) bw=ihf-a maximum output voltage v om 2.0 2.2 vrms thd+n=1% bw=400-30khz
3/4 rev. input selector (3 single-end) volume/mute 2 band eq (tone control) i 2 c bus logic gnd vcc/2 input gain 20 19 18 17 16 15 14 13 12 11 fader 1 2 3 4 5 6 7 8 9 10 fader fader fader vcc dimensional outline drawing block diagram descriptions of terminal terminal no. terminal name 1 a1 2 a2 3 b1 4 b2 5 c1 6 c2 7 test1 8 test2 9 test3 10 nc 11 outr2 12 outr1 13 outf2 14 outf1 15 vcc 16 mute 17 scl 18 sda 19 gnd 20 fil ssop-a20 (unit mm) max9.05(include.burr) bd lot no.
4/4 rev. cautions on use (1) absolute maximum ratings if applied voltage, operating temperatur e range, or other absolute maximum ratings are exceeded, the lsi may be damaged. do not apply voltages or temperatures that exc eed the absolute maximum ratings. if you think of a case in which absolute maximum ratings are exceed ed, enforce fuses or other physical safety measures and investigate how not to apply the conditions under which absolute maximum ratings are exceeded to the lsi. (2) gnd potential make the gnd pin voltage such that it is the lowest voltage even when oper ating below it. actually confirm that the voltage of each pin does not become a lower voltage than the gnd pin, including transient phenomena. (3) thermal design perform thermal design in which there are adequate ma rgins by taking into account the allowable power dissipation in actual states of use. (4) shorts between pins and misinstallation when mounting the lsi on a board, pa y adequate attention to orientation and placement discrepancies of the lsi. if it is misinstalled and the power is turned on, the lsi may be damaged. it also may be damaged if it is shorted by a foreign substance coming between pins of the lsi or between a pin and a power supply or a pin and a gnd. (5) operation in strong magnetic fields adequately evaluate use in a strong magnetic field, since there is a possibility of malfunction.
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